Sensors Converge 2024

Initiating and executing upon a design employing sensor and multi-chip packaging is daunting, requiring thought for not only “what to build,” but “how to build it” and “who can build it.”  We review common design challenges within heterogeneously integrated sensor devices, highlighting interrelated considerations necessary to achieve proper device functionality and product yield.  A risk-based framework can be employed to weigh tradeoffs between functional performance, form factor, and manufacturability, starting at top-level system function, extending to material selection, key layout decisions, and the impact of integrating electrical and non-electrical devices.  Finally, we describe challenges afforded by these decisions associated with sourcing and building physical parts, spanning prototyping, pre-production, and at scale.